Title:
ELECTRONIC COMPONENT AND METHOD FOR FORMING RESIN LAYER ON ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/130739
Kind Code:
A1
Abstract:
Provided is an electronic component for which the trimmable thickness of a conductor is large, and the range within which electrical characteristics of an element, etc. can be adjusted is large. An electronic component 1C according to the present invention comprises: a plurality of laminated insulation layers 2; a surface conductor 4 formed on a surface 21a of an insulation layer 2; and an internal conductor 7 formed at a boundary section between adjacent insulation layers. The surface conductor 4 is configured such that the thickness thereof is thicker than the thickness of the thinnest layer 23A of the insulation layers 2 and thicker than the thickness of the internal conductor 7. A plurality of connection conductors 3 are formed inside an insulation layer 2 or on the surface 21a of an insulation layer 2, and each connection conductor 3 is electrically connected to the surface conductor 4.
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Inventors:
HIRAKAWA NAGANORI (JP)
Application Number:
PCT/JP2021/036635
Publication Date:
June 23, 2022
Filing Date:
October 04, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F17/00; H01F27/00
Foreign References:
| JPH09270325A | 1997-10-14 | |||
| JP2013098540A | 2013-05-20 | |||
| JP2002289464A | 2002-10-04 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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