Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/130740
Kind Code:
A1
Abstract:
A high-frequency module (1A) is provided with: a module substrate (80) that has main surfaces (80a and 80b) facing each other; a first base material (10), at least part of which is composed of a first semiconductor material; and a second base material (20), at least part of which is composed of a second semiconductor material having higher thermal conductivity than the first semiconductor material, and upon which a power amplification circuit (21) is formed. The first base material (10) and the second base material (20) are disposed on the main surface (80a). The second base material (20) is disposed between the module substrate (80) and the first base material (10), is bonded to the first base material (10), and is connected to the main surface (80a) via an electrode (23). One of the first base material (10) and the second base material (20) is connected to the main surface (80a) via an electrode (24). In a planar view of the module substrate (80), the area of the electrode (23) is greater than the area of the electrode (24).
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Inventors:
TAKEMATSU YUJI (JP)
FUKASAWA MIKIKO (JP)
YOSHIMI SHUNJI (JP)
FUKASAWA MIKIKO (JP)
YOSHIMI SHUNJI (JP)
Application Number:
PCT/JP2021/036698
Publication Date:
June 23, 2022
Filing Date:
October 04, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/12; H01L25/00; H04B1/38
Domestic Patent References:
| WO2020090557A1 | 2020-05-07 |
Foreign References:
| US20150303971A1 | 2015-10-22 | |||
| JP2020027973A | 2020-02-20 | |||
| JP2020027974A | 2020-02-20 | |||
| JP2020027975A | 2020-02-20 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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