Title:
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/061461
Kind Code:
A1
Abstract:
This electronic component is provided with: a ceramic element assembly (10) that contains a glass; and a plurality of external electrodes that are provided to the ceramic element assembly (10). Each of the external electrodes includes a base electrode layer (15a) that includes a buffer part for buffering shock and that is provided on the ceramic element assembly (10). The base electrode layer (15a) has: a first area (15a1) that includes a buffer part of 15-50 vol% and is positioned on the ceramic element assembly (10); and a second area (15a2) that includes a buffer part of 1-10 vol% and covers the first area (15a1).
Inventors:
NAKAMURA SUMIYO (JP)
ADACHI JUN (JP)
ADACHI JUN (JP)
Application Number:
PCT/JP2017/027629
Publication Date:
April 05, 2018
Filing Date:
July 31, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01C1/148; H01C7/12; H01C17/28; H01F27/29; H01F41/10
Domestic Patent References:
| WO2014103896A1 | 2014-07-03 |
Foreign References:
| JP2007115852A | 2007-05-10 | |||
| JP2012033621A | 2012-02-16 | |||
| JP2013012688A | 2013-01-17 | |||
| JP2014093483A | 2014-05-19 | |||
| JP2001155937A | 2001-06-08 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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