ELECTRONIC COMPONENT MODULE EQUIPPED WITH HEAT SINK AND SUBSTRATE HAVING ELECTRONIC COMPONENTS MOUNTED THEREON, AND METHOD FOR PRODUCING SAME

Title:

ELECTRONIC COMPONENT MODULE EQUIPPED WITH HEAT SINK AND SUBSTRATE HAVING ELECTRONIC COMPONENTS MOUNTED THEREON, AND METHOD FOR PRODUCING SAME

Document Type and Number:

WIPO Patent Application WO/2017/094834

Kind Code:

A1

Abstract:

This electronic component module, which integrally incorporates a plurality of electronic components, is provided with a substrate, a plurality of electronic components mounted on the surface of the substrate, and a heat sink that is formed from a metal and fixed on the substrate. The substrate has a first substrate section, a second substrate section, and a third substrate section. The plurality of electronic components comprise one or more first components mounted on one surface of the first substrate section, and one or more second components mounted on one surface of the second substrate section. The first and second substrate sections are arranged such that the one surface of the first substrate section and the one surface of the second substrate section face each other. The third substrate section is interposed between the first substrate section and the second substrate section such that the first, third, and second substrate sections are arranged in a row. The heat sink has a fixing part that is fixed to at least one of the first, second, and third substrate sections, and a lateral part disposed laterally to a region (R1) that is sandwiched between the first substrate section and the second substrate section. The lateral part is connected to the fixing part via a curved part having a curved shape.

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Inventors:

YOKOCHI TOMOHIRO (JP)
HASEGAWA KENICHIRO (JP)
KAJINO HIDETADA (JP)
KASAMA YASUNORI (JP)

Application Number:

PCT/JP2016/085719

Publication Date:

June 08, 2017

Filing Date:

December 01, 2016

Export Citation:

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Assignee:

DENSO CORP (JP)

International Classes:

H05K1/02; H01L23/12; H01L23/14; H01L23/40; H01L25/065; H01L25/07; H01L25/10; H01L25/11; H01L25/18

Foreign References:

US5265322A	1993-11-30
JP2000183574A	2000-06-30
JP2013012508A	2013-01-17
JPS62118492U	1987-07-28
JP2006100302A	2006-04-13

Attorney, Agent or Firm:

TOHDA, Kiyoshi (JP)

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