Title:
ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT MODULE
Document Type and Number:
WIPO Patent Application WO/2014/021079
Kind Code:
A1
Abstract:
Provided is an electronic component which has a hollow structure, and with which deformation of the hollow structure due to pressure during module resin moulding is inhibited. The present invention is provided with: an element substrate (2); a drive unit (3) formed on one main surface of the element substrate (2); a protective unit (4) which covers the drive unit (3) such that a hollow space (8) is formed around the periphery of the drive unit (3); an adhesive layer (10) which is disposed on an upper portion of the protective unit (4), and which comprises resin; and a reinforcement plate (11) disposed on the adhesive layer (10). The present invention is configured such that the reinforcement plate (11) is a silicon substrate.
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Inventors:
KANAE MASAAKI (JP)
Application Number:
PCT/JP2013/069084
Publication Date:
February 06, 2014
Filing Date:
July 12, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H01L23/08
Domestic Patent References:
| WO2009057699A1 | 2009-05-07 |
Foreign References:
| JP2012109925A | 2012-06-07 | |||
| JP2007042786A | 2007-02-15 | |||
| JP2002252547A | 2002-09-06 |
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