Title:
ELECTRONIC COMPONENT MOUNTING PACKAGE, ELECTRONIC DEVICE, AND SUBSTRATE FOR ELECTRONIC COMPONENT MOUNTING PACKAGE
Document Type and Number:
WIPO Patent Application WO/2020/158944
Kind Code:
A1
Abstract:
The present disclosure provides: an electronic component mounting package; an electronic device; and a substrate for an electronic component mounting package. The electronic component mounting package comprises a substrate which includes: a base portion that has a first surface; and a protrusion that protrudes from the first surface and has a second surface touching the first surface. The second surface contains a portion which is inclined at an angle of less than 90° with respect to the first surface.
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Inventors:
ONDA TOMOHARU (JP)
Application Number:
PCT/JP2020/003788
Publication Date:
August 06, 2020
Filing Date:
January 31, 2020
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/12
Foreign References:
| JP2016092394A | 2016-05-23 | |||
| JP2005223083A | 2005-08-18 | |||
| JP2015082609A | 2015-04-27 |
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
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