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Title:
ELECTRONIC COMPONENT-PROTECTING MATERIAL
Document Type and Number:
WIPO Patent Application WO/1998/059004
Kind Code:
A1
Abstract:
Electronic component-protecting material excellent in mechanical properties, electric properties, heat resistance and chemical resistance and reduced in water absorption, made from a curable resin composition comprising (A) a cyclic olefinic polymer having a number-average molecular weight of 1,000 to 500,000 and (B) at least one curing agent selected from the group consisting of organic peroxides, curing agents which exhibit their effects upon heating and curing agents which exhibit their effects upon irradiation with a light.

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Inventors:
KODEMURA JUNJI (JP)
TSUNOGAE YASUO (JP)
WAKIZAKA YASUHIRO (JP)
Application Number:
PCT/JP1998/002777
Publication Date:
December 30, 1998
Filing Date:
June 22, 1998
Export Citation:
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Assignee:
NIPPON ZEON CO (JP)
KODEMURA JUNJI (JP)
TSUNOGAE YASUO (JP)
WAKIZAKA YASUHIRO (JP)
International Classes:
C09D145/00; H01L23/29; (IPC1-7): C08L45/00; C08K13/02; C08L65/00; H01L23/29
Foreign References:
JPH0649181A1994-02-22
JPH07206995A1995-08-08
JPH04248864A1992-09-04
JPH07221128A1995-08-18
JPH05163328A1993-06-29
JPH0517550A1993-01-26
JPS62240312A1987-10-21
JPH02199115A1990-08-07
Attorney, Agent or Firm:
Nishikawa, Shigeaki (43-8 Higashi-Nippori 3-chom, Arakawa-ku Tokyo, JP)
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