Title:
ELECTRONIC COMPONENT SUPPLY BODY, AND ELECTRONIC COMPONENT SUPPLY REEL
Document Type and Number:
WIPO Patent Application WO/2019/225684
Kind Code:
A1
Abstract:
Provided is an electronic component supply body in which it is possible to improve extraction performance with respect to electronic components that have both softness and tackiness. This electronic component supply body has: an embossed carrier tape 4 formed in a long shape, the embossed carrier tape 4 being such that a plurality of accommodating recesses 3 individually accommodating electronic components 2 is provided in a surface 4a; and a cover film 5 formed in a long shape, the cover film 5 being layered on the surface 4a of the embossed carrier tape 4 and thereby sealing the accommodating recesses 3. A relief part 20 is formed in an affixing surface 5a of the cover film 5, the affixing surface 5a being affixed to the embossed carrier tape 4.
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Inventors:
TAKAMATSU HIROSHI (JP)
KUROSAKI TOMOYUKI (JP)
HIYAMA TERUO (JP)
KUROSAKI TOMOYUKI (JP)
HIYAMA TERUO (JP)
Application Number:
PCT/JP2019/020400
Publication Date:
November 28, 2019
Filing Date:
May 23, 2019
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
B65D85/86; H05K13/02
Foreign References:
JP2005035636A | 2005-02-10 | |||
JP2014532602A | 2014-12-08 | |||
JP2015164157A | 2015-09-10 | |||
JP2014025047A | 2014-02-06 | |||
US20150108038A1 | 2015-04-23 | |||
JP2018100947A | 2018-06-28 | |||
JP5671266B2 | 2015-02-18 |
Other References:
See also references of EP 3805129A4
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (JP)
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