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Title:
ELECTRONIC COMPONENT, VIBRATION PLATE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2017/217308
Kind Code:
A1
Abstract:
An electronic component (101) comprises an insulation substrate (10) having a first main surface (VS1) that serves as a mounting surface, a coil that is formed on the insulation substrate (3), and mounting electrodes (P1, P2) that are connected to the coil (3) formed on the first main surface (VS1). The insulation substrate (10) is formed by laminating a plurality of insulation substrate layers (11, 12, 13). The coil (3) is configured with a coil conductor (31) formed in the insulation substrate (12), and has a winding axis (AX) in the direction of lamination (the z-axis direction) of the plurality of insulation substrate layers (11, 12, 13). The area of the first main surface (VS1) differs from the area of the first main surface (VS1) in a cross-section parallel to the first main surface (VS1) (the cross-section of the XY plane), and is smaller than the area of the cross-section closest to the first main surface (VS1) (e.g., the interface between the insulation substrate layer (12) and the insulation substrate layer (13)).

Inventors:
ITO SHINGO (JP)
Application Number:
JP2017/021254
Publication Date:
December 21, 2017
Filing Date:
June 08, 2017
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F27/06; H01F17/00; H01F27/29; H01F41/04; H05K1/02; H05K1/16; H05K3/00
Domestic Patent References:
WO2015079941A12015-06-04
WO2015129601A12015-09-03
Foreign References:
JP2012060013A2012-03-22
JPH118157A1999-01-12
JPS6052668U1985-04-13
JP2011238895A2011-11-24
JP2010010321A2010-01-14
JP2013501350A2013-01-10
JP2009034694A2009-02-19
JP2014517594A2014-07-17
JP2006287924A2006-10-19
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
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