Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2014/181756
Kind Code:
A1
Abstract:
Provided is an electronic component that can have a reduced height in the direction of lamination while effecting a reduction in DC resistance. The electronic component (10) is characterized by being provided with: a laminate body (12) resulting from laminating insulating body layers (16); a helical coil (L) containing coil conductors (18), which are provided to the insulating body layers (16), overlap each other, and form annular paths having an elongated shape, and a via hole conductor (v) that is connected to the coil conductors (18) and penetrates the insulating body layers (16) in the direction of lamination; a parallel conductor (20) that is provided to the insulating body layers (16) to which the coil conductors (18) are provided, overlaps the long side of the annular paths, and does not overlap the short side of the annular paths; and a via hole conductor (v) that connects to the coil conductor (18) in parallel the parallel conductor (20) provided to the insulating body layers (16) differing from the insulating body layers (16) to which the coil conductors (18) are provided.
Inventors:
TACHIBANA KAORU (JP)
HASHIMOTO HIROKI (JP)
HASHIMOTO HIROKI (JP)
Application Number:
PCT/JP2014/062098
Publication Date:
November 13, 2014
Filing Date:
May 01, 2014
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F17/00
Foreign References:
| JP2010245134A | 2010-10-28 | |||
| JP2013162101A | 2013-08-19 |
Attorney, Agent or Firm:
PROFIC PC (JP)
Patent business corporation pro フィック patent firm (JP)
Patent business corporation pro フィック patent firm (JP)
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