Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/131071
Kind Code:
A1
Abstract:
This electronic component comprises a laminate in which a plurality of insulation layers are laminated. The plurality of insulation layers include a first insulation layer (21) having a first surface (21f). The first surface (21f) has disposed thereon a first conductor pattern part (41) and a second conductor pattern part (42) which is adjacent to the first conductor pattern part (41). A first inter-layer connecting conductor (51) is disposed so as to penetrate, in the laminate-thickness direction, either one of the first insulation layer (21) and a second insulation layer which, among the plurality of insulation layers, is an insulation layer coming into contact with the first surface (21f). The first conductor pattern part (41) has a first region (31) to be connected to the first inter-layer connecting conductor (51). The first inter-layer connecting conductor (51) is connected to the first conductor pattern part (41) in a state of being deviated from the center of the first region (31) in an orientation away from the second conductor pattern part (42).
Inventors:
MATSUSHITA YOSUKE (JP)
Application Number:
PCT/JP2021/044892
Publication Date:
June 23, 2022
Filing Date:
December 07, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F17/00; H01F27/28
Foreign References:
| JP2004063488A | 2004-02-26 | |||
| JP2009290677A | 2009-12-10 | |||
| JP2001044038A | 2001-02-16 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
Download PDF:
Previous Patent: Al-P COMPOSITE OXIDE AND EXHAUST GAS PURIFYING CATALYST USING SAME
Next Patent: ELECTRONIC COMPONENT PACKAGE
Next Patent: ELECTRONIC COMPONENT PACKAGE