Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/264637
Kind Code:
A1
Abstract:
Provided is an electronic component in which a thick-film portion (52) is prevented from detaching from a film body (51). An insulating film (50) covers an outer surface (21) of an element body (20). The insulating film (50) comprises a film body (51) and a plurality of thick-film portions (52). The material of the film body (51) includes glass. The material of the thick-film portion (52) is the same as the glass of the film body (51). The thickness of the insulating film (50) where the thick-film portion (52) is present is greater than an average thickness of the film body (51).
Inventors:
OOSHIMA TOMOYA (JP)
HOSHINO YUUTA (JP)
YAMADA KOICHI (JP)
SASAKI MIKI (JP)
HOSHINO YUUTA (JP)
YAMADA KOICHI (JP)
SASAKI MIKI (JP)
Application Number:
PCT/JP2022/016024
Publication Date:
December 22, 2022
Filing Date:
March 30, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01C7/04; H01F27/29; H01F27/32; H01G4/30
Domestic Patent References:
| WO2020040197A1 | 2020-02-27 |
Foreign References:
| JP2019114586A | 2019-07-11 | |||
| JP2001135501A | 2001-05-18 | |||
| JP2010027730A | 2010-02-04 | |||
| JPS5280448A | 1977-07-06 |
Attorney, Agent or Firm:
FUKUI Hiroshi (JP)
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