Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/214504
Kind Code:
A1
Abstract:
The present disclosure provides an electronic component in which variations of the capacitance of a capacitor in a manufacturing process are reduced while suppressing the proportion of the area occupied by the capacitor in the electronic component. A filter device (100) as an example of the electronic component according to the present disclosure comprises: an insulator (3) that has a pair of main surfaces opposing each other and a side surface that connects the main surfaces; and a capacitor (C1) in which elements constituted by electrodes respectively formed in at least three layers in the insulator (3) are connected in series. In the capacitor (C1), electrode patterns (5f to 5h) formed in the respective layers are disposed in positions overlapping each other when viewed in plan from a stacking direction, and at least one wiring pattern (6h) is electrically connected to the electrode pattern (5h) formed in at least one layer. At least a portion of the wiring pattern (6h) extends beyond a side of the electrode pattern (5g) that overlaps thereon when viewed in plan from the stacking direction.
More Like This:
| WO/2009/066651 | LC COMPOSITE ELECTRONIC PART |
Inventors:
TACHIBANA SHINYA (JP)
Application Number:
PCT/JP2023/015175
Publication Date:
November 09, 2023
Filing Date:
April 14, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/40; H01F17/00; H01F27/00; H01G4/30; H03H7/01
Foreign References:
| JP2013162013A | 2013-08-19 | |||
| JP2005136011A | 2005-05-26 | |||
| JP2006311203A | 2006-11-09 | |||
| US5920241A | 1999-07-06 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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