Title:
ELECTRONIC DEVICE, COMPONENT MOUNTING SUBSTRATE, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2016/038795
Kind Code:
A1
Abstract:
[Problem] To provide an electronic device wherein warping of a substrate is suppressed, a component mounting substrate, and an electronic apparatus.
[Solution] According to one embodiment of the present art, an electronic device is provided with a first circuit board and a second circuit board. The first circuit board has a first main surface, a second main surface, and a plurality of external terminals. The external terminals include a first terminal group positioned at the outermost periphery, and are disposed in matrix on the first main surface. The second circuit board has a terminal surface facing the second main surface, and a plurality of connecting terminals. The connecting terminals are disposed on the terminal surface, include a second terminal group facing at least a part of the first terminal group, and are electrically connected to the second main surface.
Inventors:
SARUTA KUNIHIKO (JP)
OZAKI HIROSHI (JP)
KABASAWA HIDETOSHI (JP)
OZAKI HIROSHI (JP)
KABASAWA HIDETOSHI (JP)
Application Number:
PCT/JP2015/004085
Publication Date:
March 17, 2016
Filing Date:
August 18, 2015
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H01L21/60; H01L23/12; H01L25/065; H01L25/07; H01L25/18
Foreign References:
| JP2011155247A | 2011-08-11 | |||
| JP2013524486A | 2013-06-17 |
Attorney, Agent or Firm:
OMORI, JUNICHI (JP)
Omori Junichi (JP)
Omori Junichi (JP)
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