Title:
ELECTRONIC DEVICE COMPRISING BONDED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/225173
Kind Code:
A1
Abstract:
An electronic device of the present disclosure comprises a plurality of bonded structures comprising: a first structure having at least one opening formed therein; a second structure including at least one protrusion to be coupled to the first structure; and a support structure formed to surround at least a part of a side surface of the protrusion. The protrusion comprises: a first welded portion forming a contact surface with the upper surface of the first structure, the upper surface being adjacent to the opening; a second welded portion forming a contact surface with the inner surface of the first opening, the inner surface forming the opening; and a third welded portion forming a contact surface with the lower surface of the first structure, the lower surface being adjacent to the opening.
Inventors:
KIM TAEJEONG (KR)
JUNG SUNGCHAE (KR)
KIM MOONSOO (KR)
CHEON EONSEOG (KR)
JUNG SUNGCHAE (KR)
KIM MOONSOO (KR)
CHEON EONSEOG (KR)
Application Number:
PCT/KR2022/003025
Publication Date:
October 27, 2022
Filing Date:
March 03, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H04M1/02; B23K20/12; B23K26/20
Foreign References:
| JP2005074519A | 2005-03-24 | |||
| KR20180115312A | 2018-10-22 | |||
| JP2009119488A | 2009-06-04 | |||
| US20100196733A1 | 2010-08-05 | |||
| KR101199724B1 | 2012-11-08 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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