Title:
ELECTRONIC DEVICE COMPRISING HEAT DISSIPATION MEMBER
Document Type and Number:
WIPO Patent Application WO/2024/058469
Kind Code:
A1
Abstract:
An electronic device, according to one embodiment of the present disclosure, may comprise: a housing including a first side on which a keyboard is placed, and a second side comprising an inlet opening through which external air is introduced; a printed circuit board on which electronic components are disposed; a heat dissipation member disposed between the first side and the second side; and a cooling unit for cooling the heat dissipation member, wherein the heat dissipation member may include: a first area in which the printed circuit board is disposed; two second areas which are positioned at a distance from one end and the other end of the first area in the longitudinal and vertical directions of the electronic device, and in which the cooling unit is disposed; and a connection area which connects the first area and the second areas, and the printed circuit board and the cooling unit may be located on opposite sides of the heat dissipation member.
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Inventors:
CHO HYUNJE (KR)
NAMGUNG KICHUL (KR)
PARK CHAHOON (KR)
LEE HAEJIN (KR)
KIM JEONGSEOB (KR)
CHOI TAEHO (KR)
NAMGUNG KICHUL (KR)
PARK CHAHOON (KR)
LEE HAEJIN (KR)
KIM JEONGSEOB (KR)
CHOI TAEHO (KR)
Application Number:
PCT/KR2023/012889
Publication Date:
March 21, 2024
Filing Date:
August 30, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
G06F1/20; H05K7/20
Foreign References:
| JP2002123336A | 2002-04-26 | |||
| JP4167700B2 | 2008-10-15 | |||
| JP2021052090A | 2021-04-01 | |||
| JP5113363B2 | 2013-01-09 | |||
| US20110080710A1 | 2011-04-07 |
Attorney, Agent or Firm:
YOON & LEE INTERNATIONAL PATENT & LAW FIRM (KR)
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