Title:
ELECTRONIC DEVICE COMPRISING SHIELDING MEMBER AND HEAT DISSIPATING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/075138
Kind Code:
A1
Abstract:
An electronic device according to various embodiments of the present invention may comprise: a housing; a printed circuit board disposed inside the housing; a first electronic component and/or a second electronic component disposed on the printed circuit board; a shielding member disposed so as to surround the first electronic component and/or the second electronic component; and a first heat diffusion member formed to surround at least a part of a first surface of the shielding member.
Inventors:
RYU WANSANG (KR)
Application Number:
PCT/KR2022/013694
Publication Date:
May 04, 2023
Filing Date:
September 14, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K9/00; H04M1/02; H05K7/20
Foreign References:
| KR20210012533A | 2021-02-03 | |||
| KR101590130B1 | 2016-02-01 | |||
| KR20190106187A | 2019-09-18 | |||
| KR20200049392A | 2020-05-08 | |||
| US20180220525A1 | 2018-08-02 |
Attorney, Agent or Firm:
YOON & LEE INTERNATIONAL PATENT & LAW FIRM (KR)
Download PDF:
Previous Patent: APPARATUS AND METHOD OF MULTIMODAL CONTACTLESS VITAL SIGN MONITORING
Next Patent: GEAR TOOTH PROCESSING APPARATUS
Next Patent: GEAR TOOTH PROCESSING APPARATUS