Title:
ELECTRONIC DEVICE COMPRISING SPEAKER MODULE
Document Type and Number:
WIPO Patent Application WO/2022/215894
Kind Code:
A1
Abstract:
According to various embodiments of the present disclosure, an electronic device may comprise: a housing; a resonance space which is disposed in the housing and in which a sound-absorbing material is accommodated; and a speaker module which is disposed in the housing and includes an acoustic filter opposite to at least a part of the resonance space, wherein the acoustic filter comprises a first plate including a first through-pattern and a second plate including a second through-pattern opposite to a part of the first through-pattern.
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Inventors:
YANG SEONGKWAN (KR)
KIM KIWON (KR)
LEE BYOUNGHEE (KR)
CHO JOONRAE (KR)
PARK YOUNGBAE (KR)
KIM KIWON (KR)
LEE BYOUNGHEE (KR)
CHO JOONRAE (KR)
PARK YOUNGBAE (KR)
Application Number:
PCT/KR2022/003820
Publication Date:
October 13, 2022
Filing Date:
March 18, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H04R1/28; H04R1/02; H04R1/10; H04R3/04; H04R7/16; H04R9/06
Foreign References:
| JPH0654392A | 1994-02-25 | |||
| KR20180052291A | 2018-05-18 | |||
| US20190253789A1 | 2019-08-15 | |||
| KR20200072056A | 2020-06-22 | |||
| KR20200074554A | 2020-06-25 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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