ELECTRONIC DEVICE COOLING SYSTEM

Title:

ELECTRONIC DEVICE COOLING SYSTEM

Document Type and Number:

WIPO Patent Application WO/2017/081780

Kind Code:

A1

Abstract:

A cooling system 400 in which electronic devices are immersed in coolant and are directly cooled, said cooling system 400 comprising: a cooling tank 50 containing coolant C; and a leakage reception unit 21 disposed between the cooling tank 50 and a floor 32 so as to receive coolant L (if any) leaking from the cooling tank 50, said coolant L corresponding to a leakage portion of the coolant C. The cooling tank 50 comprises: a lower structure 53 affixed to the floor 32; an upper structure 51 in which electronic devices are immersed in the coolant C; and a seismic isolation device 55 disposed between the lower structure 53 and the upper structure 51. Thus, the present invention can provide a cooling system having a high tolerance to external strong shocks and vibrations, etc. associated with seismic hazards, etc.

More Like This:

JP6162262	A system and a method for the heat management in the portable computing device which uses heat resistance in order to predict the optimal electric power level
JP4641171	Rack mount type cooling device
WO/2015/095584	METHODS AND SYSTEMS FOR IDENTIFYING STRANDED CAPACITY

Inventors:

SAITO MOTOAKI (JP)

Application Number:

PCT/JP2015/081792

Publication Date:

May 18, 2017

Filing Date:

November 11, 2015

Export Citation:

Click for automatic bibliography generation Help

Assignee:

EXASCALER INC (JP)

International Classes:

G06F1/20; H05K7/20

Foreign References:

JPH02124415U	1990-10-12
JP2015078745A	2015-04-23
US20130105120A1	2013-05-02

Other References: