Title:
ELECTRONIC DEVICE HAVING PAD STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/225175
Kind Code:
A1
Abstract:
According to various embodiments of the present disclosure, an electronic device comprises: a housing; a printed circuit board, which is disposed in the housing and includes a fastening hole; a pad structure, which is disposed on the printed circuit board and includes a first pad for encompassing at least a portion of the fastening hole, a second pad spaced apart from the first pad, and a third pad spaced apart from the first pad in a direction differing from that of the second pad on the basis of the fastening hole; and a metal plate, which is disposed on the printed circuit board and includes a first plate area disposed on a first electronic component electrically connected to the second pad and the first pad, and a second plate area extending from the first plate area and disposed on the second pad or the third pad.
Inventors:
CHEON HANSU (KR)
KO YOUNGJAE (KR)
KO YOUNGJAE (KR)
Application Number:
PCT/KR2022/003068
Publication Date:
October 27, 2022
Filing Date:
March 04, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K1/11; G04G17/04
Foreign References:
| KR20210015460A | 2021-02-10 | |||
| JP2004063864A | 2004-02-26 | |||
| JPH0613171A | 1994-01-21 | |||
| JP2017191902A | 2017-10-19 | |||
| JP2005348136A | 2005-12-15 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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