Title:
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/059016
Kind Code:
A1
Abstract:
This electronic device includes: an electronic device layer (20); and barrier layers disposed above the electronic device layer (20). The barrier layers include: a gas barrier layer (40); and a liquid repelling layer (30) disposed above or below the gas barrier layer (40).
Inventors:
FUKUDA KENJIRO (JP)
XU XIAOMIN (JP)
PARK SUNGJUN (JP)
SOMEYA TAKAO (JP)
XU XIAOMIN (JP)
PARK SUNGJUN (JP)
SOMEYA TAKAO (JP)
Application Number:
PCT/JP2018/033378
Publication Date:
March 28, 2019
Filing Date:
September 10, 2018
Export Citation:
Assignee:
RIKEN (JP)
International Classes:
H01L51/44; H01L51/50; H05B33/02; H05B33/04; H05B33/10
Domestic Patent References:
| WO2014073534A1 | 2014-05-15 |
Foreign References:
| JP2004039448A | 2004-02-05 | |||
| JP2000068047A | 2000-03-03 | |||
| JPH10106746A | 1998-04-24 | |||
| JP2005100815A | 2005-04-14 | |||
| JP2012076295A | 2012-04-19 | |||
| JP2010056508A | 2010-03-11 | |||
| JPH0260088A | 1990-02-28 | |||
| US20140042399A1 | 2014-02-13 | |||
| US20140291658A1 | 2014-10-02 |
Attorney, Agent or Firm:
SANUKI, Shinichi et al. (JP)
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