Title:
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/051493
Kind Code:
A1
Abstract:
This electronic device has a polymer film which melts at a prescribed temperature higher than body temperature, at least one electronic component provided in the polymer film, and a first hydrophobic film provided on the surface of the polymer film on the side opposite the side affixed to the skin. In addition, an electronic device is manufactured by: forming a first polymer film which melts at a prescribed temperature higher than body temperature on a substrate; mounting at least one electronic component on the first polymer film; forming a second polymer film, which melts at a prescribed temperature higher than body temperature, on the first polymer film so as to cover the electronic component; forming a first hydrophobic film on the second polymer film; and peeling a device region of the electronic device that includes the first polymer film, the electronic component, the second polymer film, and the first hydrophobic film from the substrate.
Inventors:
SAKAI TAIJI (JP)
KITADA HIDEKI (JP)
SHIMIZU KOZO (JP)
KITADA HIDEKI (JP)
SHIMIZU KOZO (JP)
Application Number:
PCT/JP2016/077488
Publication Date:
March 22, 2018
Filing Date:
September 16, 2016
Export Citation:
Assignee:
FUJITSU LTD (JP)
International Classes:
H01L23/29; H01L23/31
Foreign References:
| JP2009087928A | 2009-04-23 | |||
| JP2016115388A | 2016-06-23 | |||
| JP2007167636A | 2007-07-05 | |||
| JPH05261145A | 1993-10-12 | |||
| JP2016106877A | 2016-06-20 | |||
| JP2015149364A | 2015-08-20 |
Attorney, Agent or Firm:
FURUYA Fumio et al. (JP)
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