Title:
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/122897
Kind Code:
A1
Abstract:
Provided is an electronic device that has: a substrate 10; an electronic element 80 provided on the substrate 10; and a sealing portion 20 made of a resin material for sealing the electronic element 80. The sealing portion 20 has an insertion portion 22 for inserting a fastening member 90 therethrough. The insertion portion 22 is provided in a sealing recessed portion 25 deeper than a peripheral region. At least a side surface of the sealing portion 20 and the sealing recessed portion 25 are exposed to the outside.
Inventors:
KAMADA HIDEKI (JP)
Application Number:
PCT/JP2016/088630
Publication Date:
July 05, 2018
Filing Date:
December 26, 2016
Export Citation:
Assignee:
SHINDENGEN ELECTRIC MFG (JP)
International Classes:
H01L23/28; H01L21/56
Domestic Patent References:
| WO2015151235A1 | 2015-10-08 |
Foreign References:
| JP2011238803A | 2011-11-24 | |||
| JP2010129868A | 2010-06-10 | |||
| JP2015220295A | 2015-12-07 |
Other References:
See also references of EP 3564990A4
Attorney, Agent or Firm:
OHNO Seiji et al. (JP)
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