Title:
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/286747
Kind Code:
A1
Abstract:
A method for manufacturing an electronic device, according to the present invention, comprises: a step for preparing an electronic substrate, a step for forming an insulation layer, and a step for forming a conductive layer. The step for forming an insulation layer includes a first step for applying a first insulation layer forming ink in a region in which an electronic component is not disposed and irradiating the first insulation layer forming ink with first active energy rays, and includes a region including, on the insulation layer formed in the first step, a region in which the electronic component is disposed.
Inventors:
KAMOHARA KAZUO (JP)
Application Number:
PCT/JP2022/027309
Publication Date:
January 19, 2023
Filing Date:
July 11, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H05K3/28; B41M5/00; C09D11/101; C09D11/30; C09D11/52; H01L23/28; H01L23/29; H01L23/31; H05K9/00
Domestic Patent References:
| WO2016092893A1 | 2016-06-16 | |||
| WO2010029819A1 | 2010-03-18 |
Foreign References:
| JP2008159743A | 2008-07-10 | |||
| JP2008166354A | 2008-07-17 | |||
| JP2009062523A | 2009-03-26 | |||
| JP2020060773A | 2020-04-16 | |||
| JP2020194876A | 2020-12-03 | |||
| JP2007116193A | 2007-05-10 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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