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Title:
ELECTRONIC DEVICE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/070192
Kind Code:
A1
Abstract:
An electronic device (100) comprising: electronic components (110, 120); a resin molded body (130) embedding and fixing therein the electronic components (110, 120); and a heat-transfer layer (150) having higher thermal conductivity than the resin molded body (130). The heat-transfer layer (150) comes in contact with a section other than an electrode pad (111) or terminal (122) in the electronic components (110, 120). As a result, production costs for the electronic device (100) are suppressed and the electronic device (100) can be thinner.

Inventors:
KAWAI WAKAHIRO (JP)
Application Number:
PCT/JP2017/033681
Publication Date:
April 19, 2018
Filing Date:
September 19, 2017
Export Citation:
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Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H05K1/02; H01B13/00; H05K3/00; H05K7/20
Domestic Patent References:
WO2014097641A12014-06-26
Foreign References:
JPH11121644A1999-04-30
JP2009224445A2009-10-01
JP2013101996A2013-05-23
JP2010109333A2010-05-13
JP2004134669A2004-04-30
JP2010272756A2010-12-02
Other References:
See also references of EP 3528600A4
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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