Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/013509
Kind Code:
A1
Abstract:
A stress generated on a circuit board due to fastening of a casing is reduced, and the occurrence of peeling or the like of solder is inhibited and prevented, thereby improving reliability. A casing (1) is formed by including a case (2) and a base (3) and forming fastening flanges (2b, 3b) for being fastened to each other so as to be capable of storing a circuit board (4) therein by screwing the fastening flanges (2b, 3b) to be fastened to each other. A peripheral portion of the circuit board (4) is disposed between the fastening flanges (2b, 3b), and between the peripheral portion of the circuit board (4) and the fastening flanges (2b, 3b), an elastic body (10) is provided, respectively. The circuit board (4) is sandwiched between the fastening flanges (2b, 3b) through the elastic body (10).
More Like This:
| JP5604340 | Case |
| JPH0974288 | MOUNTING STRUCTURE |
Inventors:
HIRAYAMA JUNICHI (JP)
ARAI TATSUYA (JP)
NAKANO SHINGO (JP)
NISHIYAMA MASAYUKI (JP)
YAMAMOTO MASASHI (JP)
ARAI TATSUYA (JP)
NAKANO SHINGO (JP)
NISHIYAMA MASAYUKI (JP)
YAMAMOTO MASASHI (JP)
Application Number:
PCT/JP2010/061840
Publication Date:
February 03, 2011
Filing Date:
July 13, 2010
Export Citation:
Assignee:
BOSCH CORP (JP)
HIRAYAMA JUNICHI (JP)
ARAI TATSUYA (JP)
NAKANO SHINGO (JP)
NISHIYAMA MASAYUKI (JP)
YAMAMOTO MASASHI (JP)
HIRAYAMA JUNICHI (JP)
ARAI TATSUYA (JP)
NAKANO SHINGO (JP)
NISHIYAMA MASAYUKI (JP)
YAMAMOTO MASASHI (JP)
International Classes:
H05K7/14
Foreign References:
| JPH10322075A | 1998-12-04 | |||
| JPS6030578U | 1985-03-01 | |||
| JPS645495U | 1989-01-12 | |||
| JPS6027485U | 1985-02-25 |
Attorney, Agent or Firm:
ABIKO Tsutomu (JP)
Tsutomu Abiko (JP)
Tsutomu Abiko (JP)
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