Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/145203
Kind Code:
A1
Abstract:
An electronic device (100) comprises a substrate (10), a base substrate (20), a metal connection body (30), a metal body (50), and a via (60). The substrate (10) is a piezoelectric substrate or a chemical compound semiconductor substrate provided with a functional element (11) on one main surface thereof. The substrate (10) is mounted on the base substrate (20), with the other main surface of the substrate (10) on the side opposite the one main surface facing the base substrate (20). The metal body (50) is provided to the one main surface of the substrate (10), and at least a portion of the metal body (50) is provided to the outside of the substrate (10), as viewed in a plane from the one main surface side. The via (60) connects the base substrate (20) and the portion of the metal body (50) provided outside the substrate (10), and has a higher thermal conductivity than the substrate (10).
Inventors:
IWAMOTO TAKASHI (JP)
Application Number:
PCT/JP2021/045551
Publication Date:
July 07, 2022
Filing Date:
December 10, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/34; H01L23/373; H03H9/25
Domestic Patent References:
| WO2019124127A1 | 2019-06-27 | |||
| WO2019124128A1 | 2019-06-27 | |||
| WO2008026335A1 | 2008-03-06 |
Foreign References:
| JP2004327624A | 2004-11-18 | |||
| JP2000114413A | 2000-04-21 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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