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Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/145204
Kind Code:
A1
Abstract:
An electronic device (100, 100A, 100B) of the present disclosure comprises a substrate (10), a support body (40), and a conductive film (41). The substrate (10) is a piezoelectric substrate or a chemical compound semiconductor substrate provided with a functional element (11) on one main surface (first main surface) thereof. The support body (40) is provided to the other main surface (second main surface) of the substrate (10) on the side opposite to the one main surface, and has higher thermal conductivity than the substrate (10). The conductive film (41) is formed in through-holes (40a-40d) that pass through the support body (40), and has a higher thermal conductivity than the support body (40).

Inventors:
IWAMOTO TAKASHI (JP)
Application Number:
PCT/JP2021/045552
Publication Date:
July 07, 2022
Filing Date:
December 10, 2021
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/34; H01L23/373; H03H9/25
Domestic Patent References:
WO2019124127A12019-06-27
WO2019124128A12019-06-27
Foreign References:
JP2000114413A2000-04-21
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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