ELECTRONIC DEVICES AND METHODS FOR MAKING SAME USING NANOTUBE REGIONS TO ASSIST IN THERMAL HEAT-SINKING

WIPO Patent Application WO2005031860

A3

A semiconductor device die (10, 116) is disposed on a heat-sinking support structure (30, 100). Nanotube regions (52, 120) contain nanotubes (54, 126) are arranged on a surface of or in the heatsinking support structure (30, 100). The nanotube regions (52, 120) are arranged to contribute to heat transfer from the semiconductor device die (10, 116) to the heat-sinking support structure (30, 100). In one embodiment, the semiconductor device die (10) includes die electrodes (20, 22), and the support structure (30) includes contact pads (40, 42) defined by at least some of the nanotube regions (52). The contact pads (40, 42) electrically and mechanically contact the die electrodes (20, 22). In another embodiment, the heat-sinking support structure (100) includes microchannels (120) arranged laterally in the support structure (100). At least some of the nanotube regions are disposed inside the microchannels (100).

JPH07251130	FORMATION OF WATER-REPELLENT COATING FILM
JP2005325351	ANTIFOGGING MEMBER AND MEMBER HAVING CLEANED SURFACE
WO/2006/024749	METHOD OF PRODUCING A HEAT EXCHANGER, COMPRISING A SURFACE TREATMENT, AND HEAT EXCHANGER THUS PRODUCED

ARIK MEHMET
WEAVER STANTON E JR
CARNAHAN JAMES C
BECKER CHARLES A
GERSTLER WILLIAM D

PCT/US2004/021712

December 01, 2005

July 07, 2004

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GELCORE LLC (US)

F28F13/18; H01L23/373; H01L23/473; H01L23/485; H01L33/64; H01L33/62; (IPC1-7): H01L23/373; H01L23/485

WO2002099845A2

2002-12-12

US20030117770A1	2003-06-26
US20020190260A1	2002-12-19
DE19832970A1	1999-11-04
US20040108589A1	2004-06-10
DE10103340A1	2002-08-22
US6407922B1	2002-06-18

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