Title:
ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2014/050864
Kind Code:
A1
Abstract:
This electronic module is provided with: an electronic device in which an electronic element is provided to a flexible substrate which does not transmit water vapour; a peripheral seal material provided to the periphery of the flexible substrate of the electronic device; and a water-vapour barrier film provided so as to seal an area surrounded by the peripheral seal material. If the square root of two times the diffusion coefficient of the peripheral seal material is K, then K = 0.1cm/√h or less. The water-vapour barrier film has at least one inorganic layer formed upon a support body comprising a transparent resin, said support body being provided to a side of the peripheral seal material.
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Inventors:
MUKAI ATSUSHI (JP)
Application Number:
PCT/JP2013/075863
Publication Date:
April 03, 2014
Filing Date:
September 25, 2013
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B27/00; H01L51/50; H05B33/02; H05B33/04
Domestic Patent References:
| WO2010024006A1 | 2010-03-04 |
Foreign References:
| JP2012164543A | 2012-08-30 | |||
| JP2012079419A | 2012-04-19 | |||
| JP2012084356A | 2012-04-26 | |||
| JP2010525540A | 2010-07-22 | |||
| JP2003223986A | 2003-08-08 | |||
| JP2006253097A | 2006-09-21 | |||
| JP2011243583A | 2011-12-01 | |||
| JPH10275679A | 1998-10-13 | |||
| JPH11135813A | 1999-05-21 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
Mochitoshi Watanabe (JP)
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