Title:
ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2019/049592
Kind Code:
A1
Abstract:
Provided is an electronic module which is able to be reduced in size and cost, and which has a wireless communication function, while being suppressed in input and output of low-frequency noises and high-frequency noises. This electronic module is provided with: a substrate 1; electronic components (a DC-DC converter 6, an RFIC 7 and a capacitor 8) which are mounted on the substrate 1; a magnetic body 10 which is formed on the substrate 1 so as to cover the electronic components; and a metal shield 11 which is formed on the magnetic body 10. An electronic circuit is configured using the electronic components; and the electronic circuit comprises a signal circuit. The metal shield 11 comprises: ground connection parts 11B, 11C, 11D which are connected to the ground electrode of the substrate 1; and a circuit connection part 11A which is connected to the signal circuit at a position different from the ground connection parts 11B, 11C, 11D.
Inventors:
YAZAKI HIROKAZU (JP)
Application Number:
PCT/JP2018/029759
Publication Date:
March 14, 2019
Filing Date:
August 08, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01Q1/24; H01Q23/00; H05K9/00
Foreign References:
| JP2012239205A | 2012-12-06 | |||
| JP2007295558A | 2007-11-08 | |||
| JP2007142960A | 2007-06-07 | |||
| JP2005051576A | 2005-02-24 |
Attorney, Agent or Firm:
KAWAMOTO, Takashi (JP)
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