Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ELECTRONIC PACKAGE SYSTEM
Document Type and Number:
WIPO Patent Application WO/2011/025579
Kind Code:
A3
Abstract:
Disclosed herein is an electronic package system utilizing a module having a liquid contact material to prevent mechanically and thermally induced strains in an electrical joint. The conductivity of the liquid contact material provides electrical communication between the required electronic components of the package system. The ability of the liquid contact material to flow prevents the creation of stresses and affords an electronic package design tolerant of small displacements or torsions. Thus, the liquid contact material enables a floating contact with high electrical reliability.

More Like This:
JP5890760A glass plate with a light incident surface having a light scattering function and a reflection suppressing function.
WO/2012/119684METALLISATION BARRIER BASED ON ALUMINIUM OXIDE
Inventors:
CLOTHIER BRENT ALLEN (US)
Application Number:
PCT/US2010/039734
Publication Date:
June 16, 2011
Filing Date:
June 24, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
GEN ELECTRIC (US)
CLOTHIER BRENT ALLEN (US)
International Classes:
H01L31/02; H01L23/00; H01L31/0203
Foreign References:
US20090001576A12009-01-01
US20060220198A12006-10-05
US5847396A1998-12-08
Attorney, Agent or Firm:
THOMAS, Jonathan, E. et al. (Global Patent Operation2 Corporate Drive, Suite 64, Shelton CT, US)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: METHOD AND SYSTEM FOR A MOTION COMPENSATED INPUT DEVICE

Next Patent: LED ASSEMBLY