ELECTRONIC UNIT

WIPO Patent Application WO/2016/092919

A1

Entry of air inside a heat-insulated space which air has been expanded by the heat of a heating process for curing a thermosetting potting material into the potting material is prevented. A casing (4) includes a compartment wall (23) that divides an opening portion (6) with a heatsink member (5) fixed thereto into a heat-generating electronic component installation compartment (21) in which a heat-generating electronic component (2a) is installed, and an adjacent compartment (22) adjacent to the heat-generating electronic component installation compartment (21). The heat-generating electronic component installation compartment (21) is filled with a thermosetting potting material (24) for moisture exclusion to a height such that at least the heat-generating electronic component (2a) is buried. The adjacent compartment (22) includes a communicating portion (25) providing communication at a position spaced apart from the heat-generating electronic component installation compartment (21) filled with the potting material (24) in the casing (4).

JP3517767	LID FOR ELECTRONIC PART PACKAGE
JP2003163342	SOLID STATE IMAGING DEVICE AND ITS MANUFACTURING METHOD
JP2013115130	METHOD OF MANUFACTURING WAFER LEVEL CSP

DAIMON YUUJI (JP)
FUJII NORIO (JP)
SUNAGA HIDEKI (JP)
SUZUKI HARUO (JP)
SHIMAMURA YUUZOU (JP)

PCT/JP2015/075196

June 16, 2016

September 04, 2015

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CALSONIC KANSEI CORP (JP)

H01L23/02; H05K5/00; H01L23/28

JPH05166954A	1993-07-02
JP2010147260A	2010-07-01
JP2013165139A	2013-08-22
JP2004228159A	2004-08-12
JPH0550788U	1993-07-02
JPH0527526U	1993-04-09

NISHIWAKI, Tamio (JP)
Tamio Nishiwaki (JP)

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