Title:
ELECTROPLATING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/107740
Kind Code:
A1
Abstract:
Provided is an electroplating apparatus including a supply mechanism for smoothly supplying an electrolyte. An electroplating apparatus according to one embodiment of the present invention comprises: a drum-shaped rotary cathode for electrodepositing a metal foil; an anode disposed along the circumferential surface shape of the rotary cathode; and an electrolyte supply mechanism for supplying an electrolyte under the rotary cathode, wherein the electrolyte supply mechanism includes a guide extending in a width direction above a supply part for supplying the electrolyte, the guide having a first extension part extending upward from the center of the supply part and a second extension part connected to the first extension part and extending to an upstream side and a downstream side of a flow path between the rotary cathode and the anode.
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Inventors:
LEE DONG-EUN (KR)
LEE JAE-KON (KR)
KIM JONG-KWEON (KR)
JUNG GWAN-HO (KR)
LEE JAE-KON (KR)
KIM JONG-KWEON (KR)
JUNG GWAN-HO (KR)
Application Number:
PCT/KR2018/012448
Publication Date:
June 06, 2019
Filing Date:
October 19, 2018
Export Citation:
Assignee:
POSCO (KR)
International Classes:
C25D1/00; C25D1/04
Foreign References:
| KR100864753B1 | 2008-10-22 | |||
| KR20080041967A | 2008-05-14 | |||
| KR100451253B1 | 2004-10-06 | |||
| JP2010090467A | 2010-04-22 | |||
| US20160273119A1 | 2016-09-22 |
Attorney, Agent or Firm:
C&S PATENT AND LAW OFFICE (KR)
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