Title:
ELECTROPLATING SOLUTION, METHOD FOR FABRICATING MULTILAYER PRINTED WIRING BOARD USING THE SOLUTION, AND MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2001/011932
Kind Code:
A1
Abstract:
An electroplating solution for fabricating a multilayer printed board in such a way that the top face of a via hole is generally flush with the top face of a conductor circuit in the same layer. The electroplating solution used for fabricating a multilayer printed board where a resin insulating layer and a conductor circuit are formed in multilayer on a board where the conductor circuit is provided, is characterized in that the electroplating solution contains 50-330 g/l of copper sulfide, 30-200 g/l of sulfuric acid, 25-90 mg/l of chloride ions, and 1-1000 mg/l of an additive at least consisting of a smoothing agent and a brightening agent.
Inventors:
EN HONCHIN (JP)
Application Number:
PCT/JP2000/004418
Publication Date:
February 15, 2001
Filing Date:
July 04, 2000
Export Citation:
Assignee:
IBIDEN CO LTD (JP)
EN HONCHIN (JP)
EN HONCHIN (JP)
International Classes:
C25D3/38; H05K3/42; H05K1/11; H05K3/10; H05K3/34; H05K3/38; H05K3/46; (IPC1-7): H05K3/46; C25D3/38; H05K3/18
Foreign References:
| JPH1154912A | 1999-02-26 | |||
| EP0419845A2 | 1991-04-03 | |||
| JPH05308194A | 1993-11-19 | |||
| JPH11186729A | 1999-07-09 | |||
| JPH1168314A | 1999-03-09 |
Other References:
See also references of EP 1207730A4
Attorney, Agent or Firm:
Yasutomi, Yasuo (Nishinakajima 5-chome Yodogawa-ku Osaka-shi Osaka, JP)
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