Title:
ELECTROSTATIC CHUCK AND PLASMA PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/095707
Kind Code:
A1
Abstract:
The present invention provides an electrostatic chuck comprising a placement unit on which a substrate and/or an edge ring is placed, an electrostatic electrode that is provided inside the placement unit and that electrostatically attracts the substrate and/or the edge ring, and an electrode that is positioned on a different surface from the surface on which the electrostatic electrode is arranged inside the placement unit. A through hole is formed in the placement unit penetrating the top surface and the bottom surface of the placement unit, and at least a portion of the electrode is arranged between the electrostatic electrode and the through hole.
Inventors:
ITO KOEI (JP)
Application Number:
PCT/JP2022/042673
Publication Date:
June 01, 2023
Filing Date:
November 17, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/683; H01L21/3065; H01L21/31; H02N13/00
Foreign References:
| JP2014522103A | 2014-08-28 | |||
| JP2021141313A | 2021-09-16 | |||
| JP2009170509A | 2009-07-30 | |||
| JP2003501829A | 2003-01-14 | |||
| JP2000277595A | 2000-10-06 | |||
| JP2019140155A | 2019-08-22 | |||
| US20120052690A1 | 2012-03-01 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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