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Patent Searching and Data


Title:
ELECTROSTATIC CHUCK AND WAFER PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/093297
Kind Code:
A1
Abstract:
Provided is an electrostatic chuck provided with: a ceramic dielectric substrate including a first main surface for placing an object to be processed and a second main surface on the opposite side from the first main surface, the ceramic dielectric substrate being a polycrystalline ceramic sintered body; an electrode layer disposed on the ceramic dielectric substrate; a base plate disposed on the second main surface side and supporting the ceramic dielectric substrate; and a heater disposed between the electrode layer and the base plate. The electrostatic chuck is characterized in that the base plate includes a through-hole penetrating the base plate and a communication passageway for passing a medium for adjusting the temperature of the object to be processed, and that, in a view from a direction perpendicular to the first main surface, at least a part of the heater is present on the through-hole side as viewed from a first portion of the communication passageway that is the closest to the through-hole.

Inventors:
ANADA KAZUKI (JP)
YOSHII YUICHI (JP)
Application Number:
PCT/JP2015/084611
Publication Date:
June 16, 2016
Filing Date:
December 10, 2015
Export Citation:
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Assignee:
TOTO LTD (JP)
International Classes:
H01L21/683; B23Q3/15; H02N13/00
Domestic Patent References:
WO2001078455A12001-10-18
Foreign References:
JP2006310832A2006-11-09
JPH08125001A1996-05-17
JP2004071647A2004-03-04
Attorney, Agent or Firm:
HYUGAJI, MASAHIKO (JP)
Masahiko Hiugaji (JP)
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