Title:
ELEMENT HOUSING PACKAGE AND MOUNTING STRUCTURE PROVIDED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2015/030034
Kind Code:
A1
Abstract:
Provided is an element housing package that can suppress reduction in the connection reliability of a wiring board and a connector. In the present invention, an element housing package (3) is provided with: a substrate (31) that has a mounting region (31b) for mounting an element (2) on an upper surface (31a); a frame body (32) that is disposed to the upper surface (31a) of the substrate (31) so as to surround the mounting region (31b) and that has a through hole (T); a connector (33) that is disposed so as to pass through the inside and extend the outside of the frame body (32) via the through hole (T) of the frame body (32); a pedestal member (34) located inside the frame body (32) and disposed to the upper surface (31a) of the substrate (31); and a wiring board (35) that is joined to an upper surface (34a) of the pedestal member (34) with a first joining member (B1) therebetween, and that is connected to the connector (33). With regard to a longitudinal section along the through direction of the through hole (T), the thickness of the frame body (32) along the through direction is thicker than the thickness of the substrate (31). With regard to a longitudinal section along the through direction of the through hole (T), the width of the pedestal member (34) is larger than the height of the pedestal member (34). A side surface (34c) of the pedestal member (34) is joined to an inner surface (32b) of the frame body (32) with a second joining member (B2) therebetween, and a lower surface (34b) of the pedestal member (34) is not joined to the upper surface (31a) of the substrate (31).
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Inventors:
SHIRASAKI TAKAYUKI (JP)
Application Number:
PCT/JP2014/072381
Publication Date:
March 05, 2015
Filing Date:
August 27, 2014
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/02
Foreign References:
| JPH07302856A | 1995-11-14 | |||
| JP2003309312A | 2003-10-31 | |||
| JP2002243992A | 2002-08-28 | |||
| JP2003174108A | 2003-06-20 | |||
| JP2003318477A | 2003-11-07 | |||
| JP2003060104A | 2003-02-28 | |||
| JP2004247511A | 2004-09-02 | |||
| JP2010171356A | 2010-08-05 | |||
| JP2003309312A | 2003-10-31 |
Other References:
See also references of EP 3041040A4
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