Title:
ENCAPSULATION ANTENNA AND PREPARATION METHOD THEREFOR, AND MOBILE COMMUNICATION TERMINAL
Document Type and Number:
WIPO Patent Application WO/2019/205883
Kind Code:
A1
Abstract:
Disclosed are an encapsulation antenna and a preparation method therefor, and a mobile communication terminal. The encapsulation antenna comprises a first substrate and a second substrate, wherein the first substrate and the second substrate abut against each other and are connected via a bonding material; a cavity wall of a cavity of the first substrate is provided with a glue overflow hole which penetrates the first substrate; a joint of a welding face of the second substrate and a cavity face is provided with a resistance welding structure; and the bonding material is arranged on the welding face, and the bonding material is connected to a second substrate face of the first substrate and extends into the glue overflow hole. Excessive bonding material is absorbed by means of the glue overflow hole so as to prevent the bonding material from affecting the abutting and the distance between the first substrate and the second substrate; and the resistance welding structure prevents the bonding material from flowing to the cavity so as to ensure the reliability of the antenna. By means of the glue overflow hole combined with the resistance welding structure, the technological problems of excessive bonding material contaminating an antenna area and of difficulty in controlling the thickness of the bonding material are effectively solved. The bonding material forms a rivet structure so that the first substrate and the second substrate are firmly and reliably connected.
Inventors:
CHANG MING (CN)
LIU GUOWEN (CN)
TANG JIAJIE (CN)
LIU GUOWEN (CN)
TANG JIAJIE (CN)
Application Number:
PCT/CN2019/080187
Publication Date:
October 31, 2019
Filing Date:
March 28, 2019
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01Q1/12
Foreign References:
| CN106374208A | 2017-02-01 | |||
| CN105609944A | 2016-05-25 | |||
| US20180076526A1 | 2018-03-15 | |||
| US20130207274A1 | 2013-08-15 |
Other References:
WANG, XIN ET AL.: "Design of a low-profile low-cost millimeter-wave Microstrip Antenna for Antenna-in-Package (AiP) Integration)", MODERN ELECTRONIC TECHNIQUE, vol. 40, no. 19, 1 October 2017 (2017-10-01), pages 1 - 5
TAJIMA, TAKURO: "Terahertz MMICs and Antenna-in-Package Technology at 300 GHz for KIOSK Download System", J INFRARED MILLI TERAHZ WAVES (2016, vol. 37, no. 12, 31 December 2016 (2016-12-31), pages 1213 - 1224, XP036100018
TAJIMA, TAKURO: "Terahertz MMICs and Antenna-in-Package Technology at 300 GHz for KIOSK Download System", J INFRARED MILLI TERAHZ WAVES (2016, vol. 37, no. 12, 31 December 2016 (2016-12-31), pages 1213 - 1224, XP036100018
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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