Title:
ENCAPSULATION STRUCTURE OF IMAGE SENSING CHIP, AND ENCAPSULATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/007412
Kind Code:
A1
Abstract:
Disclosed are an encapsulation structure of an image sensing chip and an encapsulation method therefor. The encapsulation structure comprises: an image sensing chip, wherein the image sensing chip comprises a first surface and a second surface opposite each other, and the first surface has a plurality of pixel points for collecting image information and a plurality of first bonding pads connected to the pixel points; and a substrate covering the first surface of the image sensing chip, wherein the substrate has a wiring line and a contact end connected to the wiring line, the wiring line is used for being electrically connected to an external circuit, the periphery of the image sensing chip is bonded and fixed with the substrate by means of an anisotropic conductive adhesive, the first bonding pads are electrically connected to the contact end by means of the anisotropic conductive adhesive, and the anisotropic conductive adhesive encloses all of the pixel points at a direction perpendicular to the substrate and do not overlap with the pixel points. The technical solution of the present invention has a simple process during the encapsulation of an image sensing chip, thereby reducing the manufacturing cost.
Inventors:
WANG ZHIQI (CN)
GENG ZHIMING (CN)
GENG ZHIMING (CN)
Application Number:
PCT/CN2018/094766
Publication Date:
January 10, 2019
Filing Date:
July 06, 2018
Export Citation:
Assignee:
CHINA WAFER LEVEL CSP CO LTD (CN)
International Classes:
H01L27/146
Foreign References:
| CN107170769A | 2017-09-15 | |||
| CN101236944A | 2008-08-06 | |||
| CN106653790A | 2017-05-10 | |||
| US20050275048A1 | 2005-12-15 | |||
| CN106024823A | 2016-10-12 |
Attorney, Agent or Firm:
UNITALEN ATTORNEYS AT LAW (CN)
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