Title:
ENCAPSULATION STRUCTURE FOR SEMICONDUCTOR LASER
Document Type and Number:
WIPO Patent Application WO/2022/082875
Kind Code:
A1
Abstract:
An encapsulation structure for a semiconductor laser (4). The encapsulation structure comprises a housing (1); and a heat dissipation mechanism (3) and a transmitting hole (2), the transmitting hole (2) being provided in one side of the housing (1). The heat dissipation mechanism (3) comprises a heat dissipation box (31), a cooling device (33), an air exhaust fan (34), a mounting frame (36), a filter screen (37) and ventilation holes (38). The heat dissipation box (31) is movably inserted into the bottom of the housing (1); the air exhaust fan (34) is fixedly mounted in the middle of the bottom of an inner wall of the heat dissipation box (31); the cooling device (33) is movably inserted at the position of the inner wall of the heat dissipation box (31) away from the top of the air exhaust fan (34); the ventilation holes (38) are respectively provided in side walls of two sides of the heat dissipation box (31) and at the bottom of the side walls; and the mounting frame (36) is inserted into the ventilation holes (38) in a threaded manner. The encapsulation structure effectively solves the problems of the temperature of an existing semiconductor laser (4) when in use having a significant influence on threshold current density, slope efficiency, spectral stability, etc., and the overheating of a light-emitting area leading to the damage of a cavity surface of the light-emitting area and even the degradation of the device, finally resulting in the device failure.
Inventors:
ZHANG ZHIPING (CN)
ZHANG WENHUA (CN)
WANG NING (CN)
ZHANG WENHUA (CN)
WANG NING (CN)
Application Number:
PCT/CN2020/126883
Publication Date:
April 28, 2022
Filing Date:
November 06, 2020
Export Citation:
Assignee:
GUANGHUA LINGANG ENGINEERING APPLICATION AND TECH R&D SHANGHAI CO LTD (CN)
International Classes:
H01S5/024; H01S3/04
Foreign References:
| CN209516297U | 2019-10-18 | |||
| CN211088734U | 2020-07-24 | |||
| CN107514587A | 2017-12-26 | |||
| US20060029114A1 | 2006-02-09 |
Attorney, Agent or Firm:
NANJING HEQI PATENT AGENCY (GENERAL PARTNERSHIP) (CN)
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