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Title:
ENDOSCOPE, IMAGE PICKUP MODULE, AND METHOD FOR MANUFACTURING IMAGE PICKUP MODULE
Document Type and Number:
WIPO Patent Application WO/2017/072830
Kind Code:
A1
Abstract:
An image pickup module 1 is provided with: an image pickup element 10; an image pickup optical unit 40; a frame member 30 in which the image pickup optical unit 40 is disposed; and a wiring board 20, wherein the frame member 30 is fixed to a first main surface 20SA by means of a fixing member 60, and the image pickup element 10 is mounted on a second main surface 20SB. A gap 69 is provided between a lower surface 30SB of the frame member 30, and the first main surface 20SA of the wiring board 20, and the fixing member 60 is disposed across the gap 69.

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Inventors:
SHIMOHATA TAKAHIRO (JP)
Application Number:
PCT/JP2015/080098
Publication Date:
May 04, 2017
Filing Date:
October 26, 2015
Export Citation:
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Assignee:
OLYMPUS CORP (JP)
International Classes:
A61B1/04
Foreign References:
JP2005124963A2005-05-19
JP2015073540A2015-04-20
Attorney, Agent or Firm:
ITOH Susumu (JP)
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