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Title:
EPITAXIAL SUBSTRATE FOR ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING EPITAXIAL SUBSTRATE FOR ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/045412
Kind Code:
A1
Abstract:
Provided is an epitaxial substrate for electronic devices, said epitaxial substrate having suppressed warpage. According to the present invention, an epitaxial substrate (1) for electronic devices, said epitaxial substrate having the lateral direction as the current conduction direction, is characterized in that: the epitaxial substrate is provided with a Si single crystal substrate (2), an initially grown layer (3) formed on the Si single crystal substrate (2), a superlattice laminated body (4) formed on the initially grown layer (3), a channel layer (5) formed on the superlattice laminated body (4), and an electron supply layer (6) formed on the channel layer (5); the superlattice laminated body (4) has a superlattice structure configured by alternately laminating first layers (4a) formed of Ba1Alb1Gac1Ind1N (0≤a1<1, 0

Inventors:
YOSHIZAWA KOHEI (JP)
IKUTA TETSUYA (JP)
Application Number:
PCT/JP2014/004956
Publication Date:
April 02, 2015
Filing Date:
September 26, 2014
Export Citation:
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Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
H01L21/338; H01L21/20; H01L21/205; H01L29/778; H01L29/812
Foreign References:
JP2010245504A2010-10-28
JP2003197540A2003-07-11
JP2009519202A2009-05-14
JP2012033575A2012-02-16
JP2009120465A2009-06-04
JP2006513122A2006-04-20
Attorney, Agent or Firm:
SUGIMURA, KENJI (JP)
Kenji Sugimura (JP)
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