Title:
EPOXY COMPOUND, EPOXY RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2014/208131
Kind Code:
A1
Abstract:
Provided are: an epoxy compound having superior heat resistance and flame resistance of the cured product thereof; an epoxy resin containing the epoxy compound; a curable composition and cured product thereof; and a semiconductor sealing material. The epoxy compound is characterized by having a diarylene[b,d]furan structure, at least one of two arylene groups having a naphthalene skeleton, and both the arylene groups having a glycidyloxy group on the aromatic nucleus thereof.
Inventors:
SATOU YUTAKA (JP)
TAKAHASHI AYUMI (JP)
TAKAHASHI AYUMI (JP)
Application Number:
PCT/JP2014/054919
Publication Date:
December 31, 2014
Filing Date:
February 27, 2014
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G59/06; C07D301/28; C07D407/14; H01L23/29; H01L23/31
Foreign References:
| JP2008195849A | 2008-08-28 | |||
| JP2008189871A | 2008-08-21 | |||
| JP2008274297A | 2008-11-13 | |||
| JP2005206678A | 2005-08-04 | |||
| JP2012001687A | 2012-01-05 |
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
Michihiro Kono (JP)
Michihiro Kono (JP)
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