Title:
EPOXY RESIN COMPOSITION, CURABLE RESIN COMPOSITION, AND CURED OBJECT OBTAINED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2011/078322
Kind Code:
A1
Abstract:
Disclosed is an epoxy resin composition comprising an epoxy resin obtained by oxidizing an olefin compound represented by formula (1) and an epoxy resin obtained by oxidizing an olefin compound represented by formula (2), wherein the ratio of the epoxy resin derived from the compound of formula (1) to the epoxy resin derived from the compound of formula (2) is 10/90 to 90/10 by weight.
Inventors:
NAKANISHI MASATAKA
SASAKI CHIE
KUBOKI KENICHI
SUZUKI ZUIKAN
SASAKI CHIE
KUBOKI KENICHI
SUZUKI ZUIKAN
Application Number:
PCT/JP2010/073338
Publication Date:
June 30, 2011
Filing Date:
December 24, 2010
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
NAKANISHI MASATAKA
SASAKI CHIE
KUBOKI KENICHI
SUZUKI ZUIKAN
NAKANISHI MASATAKA
SASAKI CHIE
KUBOKI KENICHI
SUZUKI ZUIKAN
International Classes:
C08L63/00; C08G59/02; C08G59/24
Domestic Patent References:
WO2010150524A1 | 2010-12-29 |
Foreign References:
JP2007510772A | 2007-04-26 | |||
JP2010095521A | 2010-04-30 | |||
US5948922A | 1999-09-07 | |||
JP2006142756A | 2006-06-08 |
Attorney, Agent or Firm:
NAITO TERUO (JP)
Teruo Naito (JP)
Teruo Naito (JP)
Download PDF: