Title:
EPOXY RESIN, EPOXY RESIN COMPOSITION, EPOXY RESIN CURED OBJECT, AND COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2018/070534
Kind Code:
A1
Abstract:
An epoxy resin including an epoxy compound having a mesogenic structure. When a temperature-reducing step in which the temperature of the epoxy resin is reduced from 150°C to 30°C at a speed of 2°C/minute and a temperature-increasing step in which the temperature of the epoxy resin is increased from 30°C to 150°C at a speed of 2°C/minute are executed, in order, the maximum value for η'2/η'1 is no more than 20 and η'2 at 100°C is no more than 1,000 Pa·s, said η'1 being dynamic shear viscosity η'1 (Pa·s) measured in the temperature-reducing step in a temperature range of 30–150°C and said η'2 being shear viscosity η'2 (Pa·s) measured in the temperature-increasing step at the same temperature as the measurement temperature for η'1.
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Inventors:
MARUYAMA NAOKI (JP)
HIGASHIUCHI TOMOKO (JP)
FUKUDA KAZUMASA (JP)
YOSHIDA YUKA (JP)
TAKEZAWA YOSHITAKA (JP)
HIGASHIUCHI TOMOKO (JP)
FUKUDA KAZUMASA (JP)
YOSHIDA YUKA (JP)
TAKEZAWA YOSHITAKA (JP)
Application Number:
PCT/JP2017/037267
Publication Date:
April 19, 2018
Filing Date:
October 13, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08G59/24
Domestic Patent References:
| WO2016104788A1 | 2016-06-30 | |||
| WO2016104772A1 | 2016-06-30 |
Foreign References:
| JP2016113540A | 2016-06-23 | |||
| JP2016113540A | 2016-06-23 | |||
| JP2011074366A | 2011-04-14 | |||
| JP2016080629W | 2016-10-14 |
Other References:
See also references of EP 3514191A4
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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