Title:
EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/246341
Kind Code:
A1
Abstract:
An epoxy resin composition that exhibits excellent low dielectric properties and excellent copper foil peeling strength and interlayer adhesive strength in printed wiring board applications is provided. This epoxy resin composition, which contains an epoxy resin and a curing agent, is characterized by being a multivalent hydroxy resin in which part or all of the curing agent is represented by general formula (1). In the formula, the R1s independently represent C1-8 hydrocarbon groups, the R2s independently represent hydrogen atoms or dicyclopentenyl groups, wherein at least one of these is a dicyclopentenyl group. n represents the number of repeating units 0-5.
Inventors:
SOH MASAHIRO (JP)
ISHIHARA KAZUO (JP)
YU KIHWAN (KR)
JEE JOONGHWI (KR)
ISHIHARA KAZUO (JP)
YU KIHWAN (KR)
JEE JOONGHWI (KR)
Application Number:
PCT/JP2021/020543
Publication Date:
December 09, 2021
Filing Date:
May 28, 2021
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD (JP)
KUKDO CHEMICAL CO LTD (KR)
KUKDO CHEMICAL CO LTD (KR)
International Classes:
C08G59/62; C08J5/24; H05K1/03
Domestic Patent References:
| WO2020129724A1 | 2020-06-25 |
Foreign References:
| JPS61123618A | 1986-06-11 | |||
| JPS6399224A | 1988-04-30 | |||
| JPH04222819A | 1992-08-12 | |||
| JPH05339341A | 1993-12-21 | |||
| JPH07109338A | 1995-04-25 | |||
| JPH07242730A | 1995-09-19 |
Other References:
OGURA, ICHIRO: "Relation between Chemical Structures and Characteristics on Epoxy Resins", DIC TECHNICAL REVIEW, 2001, pages 1 - 12, XP009527516, Retrieved from the Internet
Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
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