Title:
EPOXY RESIN COMPOSITION, FILM, FILM PRODUCTION METHOD, AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/286499
Kind Code:
A1
Abstract:
This epoxy resin composition comprises: a component (A) which is an epoxy resin; a component (B) which is a microcapsule-type curing agent; a component (C) which is a reactive diluent; and a component (D) which is a compound represented by formula (1). (In formula (1), X1 has two to five consecutive carbon-carbon bonds, and the substituent of carbon contained in X1, and R1-R5 are each one selected from the group consisting of hydrogen, an alkyl group, an unsaturated aliphatic group, an aromatic group, a heteroatom-containing substituent, a halogen atom-containing substituent, and a halogen atom. The substituent of carbon contained in X1, and R1-R5 may be the same as or different from each other. Moreover, one selected from among R1-R5 may be a fused ring compound present in the same ring.)
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Inventors:
KOBAYASHI NAOHIRO (JP)
YOSHIDA MASANORI (JP)
ONIZUKA KENZO (JP)
YOSHIDA MASANORI (JP)
ONIZUKA KENZO (JP)
Application Number:
PCT/JP2022/023186
Publication Date:
January 19, 2023
Filing Date:
June 08, 2022
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
C08G59/24; C08G59/36; C08G59/40; C08J5/18
Foreign References:
| JP2012007003A | 2012-01-12 | |||
| JP2012007004A | 2012-01-12 | |||
| JP2009521589A | 2009-06-04 | |||
| JP2003007927A | 2003-01-10 | |||
| JP2004269721A | 2004-09-30 | |||
| JP2001511170A | 2001-08-07 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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