Title:
EPOXY RESIN COMPOSITION, HARDENING PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, NOVEL EPOXY RESIN, NOVEL POLYHYDROXY COMPOUND AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2006/112438
Kind Code:
A1
Abstract:
An epoxy resin composition that can be hardened rapidly, excelling in the flame retardance of a hardening product thereof obtainable even without the use of any halogen flame retardant, and that further excels in heat resistance. There are provided a hardening product thereof; a semiconductor sealing material comprising the epoxy resin composition; a novel epoxy resin and novel hydroxyl compound that can be used in the epoxy resin composition; and a process for producing the same.
Inventors:
SATO YUTAKA (JP)
OGURA ICHIROU (JP)
TAKAHASHI YOSHIYUKI (JP)
MORINAGA KUNIHIRO (JP)
ARITA KAZUO (JP)
OGURA ICHIROU (JP)
TAKAHASHI YOSHIYUKI (JP)
MORINAGA KUNIHIRO (JP)
ARITA KAZUO (JP)
Application Number:
PCT/JP2006/308044
Publication Date:
October 26, 2006
Filing Date:
April 17, 2006
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
SATO YUTAKA (JP)
OGURA ICHIROU (JP)
TAKAHASHI YOSHIYUKI (JP)
MORINAGA KUNIHIRO (JP)
ARITA KAZUO (JP)
SATO YUTAKA (JP)
OGURA ICHIROU (JP)
TAKAHASHI YOSHIYUKI (JP)
MORINAGA KUNIHIRO (JP)
ARITA KAZUO (JP)
International Classes:
C08G59/20; C08G59/62; C08G61/02
Foreign References:
| JP2004339277A | 2004-12-02 | |||
| JP2004244526A | 2004-09-02 | |||
| JPH08120039A | 1996-05-14 |
Attorney, Agent or Firm:
Shiga, Masatake (Yaesu Chuo-ku, Tokyo53, JP)
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