Title:
EPOXY RESIN COMPOSITION, POTTING MATERIAL, AND POTTING MATERIAL FOR HOLLOW-FIBER MEMBRANE MODULE
Document Type and Number:
WIPO Patent Application WO/2018/037497
Kind Code:
A1
Abstract:
The present invention provides an epoxy resin composition which cures at low temperatures, is inhibited from generating heat during curing, has excellent flowability, and can give cured objects having excellent mechanical strength. The epoxy resin composition of the present invention is characterized by comprising: a main ingredient which comprises 100 parts by mass of a liquid epoxy resin and 2-120 parts by mass of a (meth)acryloyl-containing compound having an acryloyl equivalent of 350 or less; and a polyfunctional amine hardener which has amino groups bonded to secondary carbon atoms and which has a total amine value of 60 or higher.
Inventors:
SHIMAMURA KAZUYORI (JP)
WATANABE ICHIRO (JP)
WATANABE ICHIRO (JP)
Application Number:
PCT/JP2016/074634
Publication Date:
March 01, 2018
Filing Date:
August 24, 2016
Export Citation:
Assignee:
SEKISUI FULLER CO LTD (JP)
International Classes:
C08L63/00; C08G59/50
Foreign References:
| JPH02503686A | 1990-11-01 | |||
| JP2000309625A | 2000-11-07 | |||
| JPH09296027A | 1997-11-18 | |||
| JP2005034715A | 2005-02-10 | |||
| JP2004209418A | 2004-07-29 | |||
| JPH08239558A | 1996-09-17 | |||
| JPH11124539A | 1999-05-11 | |||
| JP2016153490A | 2016-08-25 |
Attorney, Agent or Firm:
YAMAMOTO, Takuya (JP)
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